The company says the new architecture will result in better performance with less power.
Intel has shown off the design of its next generation of chips. The new transistor design, which uses a three-dimensional gate rather than a flat one, will go into production at the company's fabs over the next year. The company says the three-dimensional structure will allow the company to double the density of its chips while also providing performance gains and lower power consumption. The design will first be rolled out in the company's Core processor chips, used for desktops. After that they'll be integrated into Intel's mobile and handheld chip line, called Atom.
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